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Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026

Enabling developers to build, integrate, and deploy edge AI solutions at scale SANTA CLARA, Calif., — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show, Ambarella’s theme, “The Ambarella Edge: From Agentic to Physical AI,” […]

Ambarella to Showcase “The Ambarella Edge: From Agentic to Physical AI” at Embedded World 2026 Read More +

Vision Components unveils all-in-one VC EvoCam with MediaTek processor

Ettlingen, February 18, 2026 — Vision Components is presenting the VCSBC EvoCam for the first time at embedded world, a new generation of all-in-one intelligent board-level cameras featuring the MediaTek Genio 510 processor. Measuring tiny 65 x 40 mm, the camera is equipped with all necessary components for image acquisition and image processing, making the

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e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation

California & Chennai (February 17, 2026): e-con Systems, a global leader in embedded vision solutions, launches DepthVista Helix 3D CW iToF Camera, a high-performance depth camera engineered to deliver reliable and accurate 3D perception for wide range of industrial robotics applications, including Autonomous Mobile Robots (AMRs), pick-and-place, bin-picking, palletization and depalletization robots, industrial safety and automation, and

e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation Read More +

Upcoming Webinar on CSI-2 over D-PHY & C-PHY

On February 24, 2026, at 9:00 am PST (12:00 pm EST) MIPI Alliance will deliver a webinar “MIPI CSI-2 over D-PHY & C-PHY: Advancing Imaging Conduit Solutions” From the event page: MIPI CSI-2®, together with MIPI D-PHY™ and C-PHY™ physical layers, form the foundation of image sensor solutions across a wide range of markets, including

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Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making

Chandler, Ariz., February 10, 2026 — A major next step for artificial intelligence (AI) and machine learning (ML) innovation is moving ML models from the cloud to the edge for real-time inferencing and decision-making applications in today’s industrial, automotive, data center and consumer Internet of Things (IoT) networks. Microchip Technology (Nasdaq: MCHP) has extended its edge AI offering

Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making Read More +

Upcoming Webinar on Industrial 3D Vision with iToF Technology

On February 18, 2026, at 9:00 am PST (12:00 pm EST), and on February 19, 2026 at 11:00 am CET, Alliance Member company e-con Systems in partnership with onsemi will deliver a webinar “Enabling Reliable Industrial 3D Vision with iToF Technology” From the event page: Join e-con Systems and onsemi for an exclusive joint webinar

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Google Adds “Agentic Vision” to Gemini 3 Flash

Jan. 30, 2026 — Google has announced Agentic Vision, a new capability in Gemini 3 Flash that turns image understanding into an active, tool-using workflow rather than a single “static glance.” Agentic Vision pairs visual reasoning with code execution (Python) so the model can iteratively zoom in, crop, annotate, and otherwise manipulate an image to

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Robotics Builders Forum offers Hardware, Know-How and Networking to Developers

On February 25, 2026 from 8:30 am to 5:30 pm ET, Advantech, Qualcomm, Arrow, in partnership with D3 Embedded, Edge Impulse, and the Pittsburgh Robotics Network will present Robotics Builders Forum, an in-person conference for engineers and product teams. Qualcomm and D3 Embedded are members of the Edge AI and Vision Alliance, while Edge Impulse

Robotics Builders Forum offers Hardware, Know-How and Networking to Developers Read More +

NanoXplore and STMicroelectronics Deliver European FPGA for Space Missions

Key Takeaways: NanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications The product leverages a supply chain fully based in the European Union, from design to manufacturing and test, and delivered by ST Its advanced digital capability enables European customers to develop higher performance, more competitive satellites

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Voyager SDK v1.5.3 is Live, and That Means Ultralytics YOLO26 Support

Voyager v1.5.3 dropped, and Ultralytics YOLO26 support is the big headline here. If you’ve been following Ultralytics’ releases, you’ll know Ultralytics YOLO26 is specifically engineered for edge devices like Axelera’s Metis hardware. Why Ultralytics YOLO26 matters for your projects: The architecture is designed end-to-end, which means no more NMS (non-maximum suppression) post-processing. That translates to simpler deployment and

Voyager SDK v1.5.3 is Live, and That Means Ultralytics YOLO26 Support Read More +

Here you’ll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind.

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