SANTA CLARA, Calif., — Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that it will exhibit at Embedded World 2026, taking place March 10-12 in Nuremberg, Germany. At the show, Ambarella’s theme, “The Ambarella Edge: From Agentic to Physical AI,” will anchor live demonstrations that highlight how Ambarella’s AI SoCs, software stack, and developer tools deliver a competitive advantage across a wide range of AI applications—from agentic automation and orchestration to physical AI systems deployed in real-world environments.

Ambarella’s exhibit will showcase a scalable AI SoC portfolio providing high AI performance per watt, complemented by a software platform that supports rapid development across diverse edge AI workloads, consistent performance characteristics, and efficient deployment at the edge. Live demos will feature differentiation at the stack-level, partner solutions, and developer workflows across robotics, industrial automation, automotive, edge infrastructure, security, and AIoT use cases.

“Developers are increasingly building AI applications that must operate under strict power, latency, and reliability constraints, while still delivering high levels of performance,” said Muneyb Minhazuddin, Customer Growth Officer at Ambarella. “Here, we are showing how Ambarella’s ecosystem—bringing together performance-efficient AI SoCs with a robust software stack, sample workflows, and engineering resources—accelerates the development of edge AI solutions for a wide range of vertical industry segments.”

Ambarella will also present its Developer Zone (DevZone), giving developers, partners, independent software vendors (ISVs), module builders, and system integrators hands-on access to software tools, optimized models, and agentic blueprints. Together, these elements make it easier for teams to integrate more efficiently and deploy at scale using Ambarella’s technology.

Ambarella’s exhibit will be located in Hall 5, Booth 5-355 at Embedded World 2026. To schedule a guided tour, please contact your Ambarella representative.

About Ambarella
Ambarella’s products are used in a wide variety of edge AI and human vision applications, including video security, advanced driver assistance systems (ADAS), electronic mirrors, telematics, driver/cabin monitoring, autonomous driving, edge infrastructure, drones and other robotics applications. Ambarella’s low-power systems-on-chip (SoCs) offer high-resolution video compression, advanced image and radar processing, and powerful deep neural network processing to enable intelligent perception, sensor fusion and planning. For more information, please visit
www.ambarella.com.

Ambarella Contacts

• Media contact: Molly McCarthy, mmccarthy@ambarella.com, +1 408-400-1466
• Investor contact: Louis Gerhardy, lgerhardy@ambarella.com, +1 408-636-2310
• Sales contact: https://www.ambarella.com/contact-us/

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Embedded World Hall 2, Booth 2-551

All-in-one camera with MediaTek Genio 510 processor
The VC EvoCam can be configured with an onboard image sensor or with one or two cable-connected remote-head cameras. Image sensors from the VC MIPI Camera portfolio are available for this purpose; the first VC EvoCam presented at embedded world is equipped with the Sony  IMX900 image sensor featuring 3.2 MP resolution and globalshutter. The MediaTek Genio 510 Edge AI processor is integrated for direct image processing. It features two ARM Cortex-A78 and four ARM Cortex-A55 cores, an ARM Mali GPU, and an NPU with a performance of 3.2 TOPS. Up to 2 GB of RAM, 16 GB of flash memory, and expandability via SD 3.0 enable the processing and storage of extensive image data. The VC EvoCam is supplied with a customized Debian Linux operating system. Common image processing functions are directly supported and
included as demo applications.

Individual adaptation with interface boards
For integration into devices and applications, the VC EvoCam features a 100-pin board-to-board connector. Signals for interfaces and processor functionalities are made available here, including I/Os, I²C, USB, Ethernet, Video DSI, and PCIe. At the start of volume production in the first half of 2026, a minimalist interface board will be available, featuring power supply, I/Os for trigger and flash, as well as USB and RJ45/LAN. A more extensive interface board will follow shortly as a development kit and for prototyping, routing all connector signals to physical interfaces. Vision Components supports customers in the development of individual interface boards as well as the design-in of the VC EvoCam.

Celebrating 30 Years of VC Smart Cameras
In 2026, Vision Components celebrates its 30th anniversary. In 1996, the company presented the first industrial-grade smart camera, developed by company founder Michael Engel. The VC EvoCam now marks another milestone, with the high computing power of the MediaTek processor, flexibly adaptable for numerous applications, and with a freely programmable Linux operating system for easy and rapid integration.

At embedded world, alongside the new VC EvoCam, Vision Components is showing the new VC MIPI IMX454 Camera Module for multispectral imaging, the VC MIPI Multiview Cam with nine image sensors for customer-specific multiview and multispectral applications, as well as the VC MIPI Portfolio of flexible and industrial-grade cameras with MIPI CSI-2 interface. The components of the VC MIPI Bricks System for plug-and-play vision integration will also be on display. It comprises various cable options and lens holders as well as ready-to-use MIPI CSI-2 Cameras.

About Vision Components
Vision Components is a leading manufacturer of embedded vision systems with over 25 years of experience. The product range extends from versatile MIPI camera modules to freely programmable cameras with ARM/Linux and OEM systems for 2D and 3D image processing. The company was founded in 1996 by Michael Engel, inventor of the first industrial-grade intelligent camera. VC operates worldwide, with sales offices in the USA, Japan, and UAE as well as local partners in over 25 countries.

Company contact:
Vision Components GmbH

Jan-Erik Schmitt

+49 7243 216 7-0
schmitt@vision-components.com
Ottostraße 2 | 76275 Ettlingen
www.vision-components.com

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This new camera is based on a 1.2MP onsemi Hyperlux ID AF0130 global shutter depth sensor, delivering simultaneous high-resolution depth, confidence, and IR grayscale streams using Continuous-Wave indirect Time of Flight (CW-iTOF) technology. It is designed for seamless integration with NVIDIA Jetson Orin platforms.

A key differentiator of the DepthVista Helix is its dual VCSEL illumination architecture, engineered to strike the optimal balance between performance, cost, and mechanical design. To simplify deployment, e-con Systems provides the DepthVista SDK, which includes V4L2-based Linux camera drivers, Depth visualization and control tools, reference applications for Static box dimensioning and Pose estimation. This software framework significantly reduces development time and enables faster evaluation, prototyping, and production deployment.

Key Capabilities of the DepthVista Helix 3D CW iToF Camera include

• On-camera depth computation with integrated on-chip depth processing ensures exceptional depth precision with <1% deviation over 0.2m–2m and 0.5m–6m ranges.
• High-resolution depth sensing delivering 1.2MP @ 60 fps.
• IP67 rated camera design with GMSL2 cable support
• Multi-camera interference mitigation to ensure stable depth performance when multiple cameras deployed on robots or in multi-robot environments
• Compatibility with NVIDIA Jetson platforms, including Orin NX and Orin AGX.
• Dual-frequency CW iToF operation supporting long-range, high-precision depth measurement with improved multipath suppression.
• Advanced depth confidence filtering to suppress reflections, edge noise, and unstable depth pixels.
• Narrow field of view (NFOV) of the depth camera enables precise distance measurement with dense point-cloud data and reduced multipath interference
• GMSL and USB interface options to support flexible system Integration
• Optional RGB sensor support for simultaneous capture of visual and depth data.
• DepthVista SDK with Linux drivers, sample applications, and depth visualization tools.

“For industrial robotics, depth sensing must deliver metric accuracy with predictable and repeatable behavior under real operating conditions, not just favorable lab performance. With the DepthVista Helix 3D CW indirect Time-of-Flight camera, we provide 1.2MP per-pixel depth measurement based on phase-shift analysis of modulated illumination, enabling robots to reconstruct true scene geometry rather than relying on appearance-based or inferred depth cues. This system-level approach enables reliable detection of fine and low-profile obstacles, improved grasp localization accuracy, and stable navigation even in low ambient light, reflective environments, and optically complex multi-robot warehouse deployments,” said Prabu Kumar Kesavan, CTO at e-con Systems.

“onsemi’s AF0130, part of the Hyperlux ID iToF family, is engineered for precise real‑time 3D sensing in industrial environments. Its global shutter and unique pixel architecture capture and store all phases simultaneously, minimizing motion artifacts. Combined with integrated on‑chip depth processing, the sensor outputs depth, confidence, and intensity data, making it ideal for robotic applications including autonomous mobile robots, material handling systems, and access control systems,” said Steve Harris, senior director of marketing, Industrial and Commercial Sensing Division, onsemi..

Availability

To evaluate the capabilities of DepthVista Helix Camera, please visit our online web store and purchase the product.

Customization and Integration Support

e-con Systems offers customization services and end-to-end integration support for the cameras and compute box, ensuring that unique application requirements can be easily met. For customization or integration support, please contact us at camerasolutions@e-consystems.com.

About e-con Systems

e-con Systems® designs, develops, and manufactures embedded vision solutions – from custom OEM cameras to complete ODM platforms. With 20+ years of experience and expertise in embedded vision, it focuses on delivering vision and camera solutions to industries such as retail, medical, industrial, mobility, agriculture, smart city, and more. e-con Systems’ wide portfolio of products includes Time of Flight cameras, MIPI camera modules, GMSL cameras, USB cameras, stereo cameras, GigE cameras, HDR cameras, low light cameras, and more. Our cameras are currently embedded in over 350+ customer products, and we have shipped over 2 million cameras to the United States, Europe, Japan, South Korea, and many other countries.

For more information, please contact:

Mr. Harishankkar
VP – Business Development
sales@e-consystems.com
e-con Systems® Inc.,
+1 408 766 7503
Website: www.e-consystems.com

The post e-con Systems Launches DepthVista Helix 3D CW iToF Camera for Robotics and Industrial Automation appeared first on Edge AI and Vision Alliance.

MIPI CSI-2®, together with MIPI D-PHY and C-PHY physical layers, form the foundation of image sensor solutions across a wide range of markets, including smartphones, computing, automotive, robotics and beyond. This webinar will explore the latest CSI-2 feature developments and the continued evolution of MIPI’s low-energy, high-performance physical layer transport solutions–D-PHY and C-PHY–which leverage differential and ternary signaling, respectively.

Attendees will gain insight into recently adopted capabilities such as event-based sensing and processing, as well as D‑PHY embedded clock mode. The session will also cover near-term enhancements, including dual-PHY macro support and multi-drop bus capability, along with a forward-looking view of longer-term feature developments. By the close of the webinar, attendees will understand how MIPI imaging solutions are enabling next-generation computer and machine vision applications across a wide range of product ecosystems.

Register Now »

Featured Speakers:

Haran Thanigasalam, Chair of the MIPI Camera Working Group and Camera Interest Group

Raj Kumar Nagpal, Chair of the MIPI D-PHY Working Group

George Wiley, Chair of the MIPI C-PHY Working Group

For more information and to register, visit the event page.

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Microchip’s products are long-time embedded-design workhorses, and the new solutions turn its MCUs and MPUs into complete platforms for bringing secure, efficient and scalable intelligence to the edge. The company has rapidly built and expanded its growing, full-stack portfolio of silicon, software and tools that solve edge AI performance, power consumption and security challenges while simplifying implementation.

“AI at the edge is no longer experimental—it’s expected, because of its many advantages over cloud implementations,” said Mark Reiten, corporate vice president of Microchip’s Edge AI business unit. “We created our Edge AI business unit to combine our MCUs, MPUs and FPGAs with optimized ML models plus model acceleration and robust development tools. Now, the addition of the first in our planned family of application solutions accelerates the design of secure and efficient intelligent systems that are ready to deploy in demanding markets.”

Microchip’s new full-stack application solutions for its MCUs and MPUs encompass pre-trained and deployable models as well as application code that can be modified, enhanced and applied to different environments. This can be done either through Microchip’s embedded software and ML development tools or those from Microchip partners. The new solutions include:

• Detection and classification of dangerous electrical arc faults using AI-based signal analysis
• Condition monitoring and equipment health assessment for predictive maintenance
• Facial recognition with liveness detection supporting secure, on-device identity verification
• Keyword spotting for consumer, industrial and automotive command-and-control interfaces

Development Tools for AI at the Edge
Engineers can leverage familiar Microchip development platforms to rapidly prototype and deploy AI models, reducing complexity and accelerating design cycles. The company’s MPLAB? X Integrated Development Environment (IDE) with its MPLAB Harmony software framework and MPLAB ML Development Suite plug-in provides a unified and scalable approach for supporting embedded AI model integration through optimized libraries. Developers can, for example, start with simple proof-of-concept tasks on 8-bit MCUs and move them to production-ready high-performance applications on Microchip’s 16- or 32-bit MCUs.

For its FPGAs, Microchip’s VectorBlox Accelerator SDK 2.0 AI/ML inference platform accelerates vision, Human-Machine Interface (HMI), sensor analytics and other computationally intensive workloads at the edge while also enabling training, simulation and model optimization within a consistent workflow.

Other support includes training and enablement tools like the company’s motor control reference design featuring its dsPIC? DSCs for data extraction in a real-time edge AI data pipeline, and others for load disaggregation in smart e-metering, object detection and counting, and motion surveillance. Microchip also helps solve edge AI challenges through complementary components that are required for product design and development. These include PCIe? devices that connect embedded compute at the edge and high-density power modules that enable edge AI in industrial automation and data center applications.

The analyst firm IoT Analytics stated in its October 2025 market report that embedding edge AI capabilities directly into MCUs is among the top four industry trends, enabling AI-driven applications “…that reduce latency, enhance data privacy, and lower dependency on cloud infrastructure.” Microchip’s AI initiative reinforces this trend with its MCU and MPU platform, as well as its FPGAs. Edge AI ecosystems increasingly require support for both software AI accelerators and integrated hardware acceleration on multiple devices across a range of memory configurations.

Availability
Microchip is actively working with customers of its full-stack application solutions, providing a variety of model training and other workflow support. The company is also working with multiple partners whose software provides developers with additional deployment-ready options. To learn more about Microchip’s edge AI offering and new full-stack solutions, visit www.microchip.com/EdgeAI. Additional information on each solution can be found at Microchip’s on-demand Edge AI Webinar Series, starting February 17.

About Microchip
Microchip Technology Inc. is a broadline supplier of semiconductors committed to making innovative design easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio support customers throughout the design process, from concept to completion. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. For more information, visit the Microchip website at www.microchip.com.

The post Production-Ready, Full-Stack Edge AI Solutions Turn Microchip’s MCUs and MPUs Into Catalysts for Intelligent Real-Time Decision-Making appeared first on Edge AI and Vision Alliance.

Join e-con Systems and onsemi for an exclusive joint webinar on how Time-of-Flight (iToF) based 3D vision is enabling reliable perception for modern robotic applications, industrial and warehouse automation workflows.

Vision experts will discuss how industrial teams can leverage iToF sensor capabilities into deployable 3D vision solutions while addressing the perception challenges commonly faced in complex industrial environments.

Attendees will gain insights from proven customer success stories in field deployments, including parcel box dimensioning, autonomous pallet handling, obstacle detection, and collision avoidance in warehouse environments.

Register Now »

Featured Speakers:

Radhika S, Senior Project Lead, e-con Systems

Aidan Browne, Product Marketing Manager – Depth Sensing, onsemi

Key insights you’ll gain:

• Key industrial applications driving the adoption of iToF-based 3D vision
• Common perception challenges in industrial environments
• Translating sensor capability into deployable robotics vision solutions
• Proven customer success stories from field deployments

For more information and to register, visit the event page.

The post Upcoming Webinar on Industrial 3D Vision with iToF Technology appeared first on Edge AI and Vision Alliance.

Agentic Vision pairs visual reasoning with code execution (Python) so the model can iteratively zoom in, crop, annotate, and otherwise manipulate an image to verify details before responding—helping reduce guesswork on fine-grained elements like serial numbers or distant text.

According to Google DeepMind, this approach follows a “Think, Act, Observe” loop: the model forms a multi-step plan, executes Python to transform or analyze the image, then appends the transformed output back into its context window to support a more grounded final answer.

Google reports that enabling code execution with Gemini 3 Flash delivers a consistent 5–10% quality boost across most vision benchmarks. The company also highlights early developer use cases, including iterative inspection of high-resolution documents (e.g., building-plan validation) and “visual scratchpad” style annotation to reduce counting and localization errors.

Beyond inspection and annotation, Agentic Vision can offload multi-step visual arithmetic to a deterministic Python environment—parsing dense visual tables, normalizing values, and generating charts (e.g., with Matplotlib) rather than relying on probabilistic reasoning alone.

Availability and next steps
Agentic Vision is available now via the Gemini API in Google AI Studio and Vertex AI, and is beginning to roll out in the Gemini app (via the “Thinking” model selection). Google says it plans to make more code-driven behaviors implicit over time, expand tooling (including ideas like web and reverse image search), and bring the capability to additional model sizes beyond Flash.

Original announcement (with full details and examples): Google’s blog post.

The post Google Adds “Agentic Vision” to Gemini 3 Flash appeared first on Edge AI and Vision Alliance.

Here’s the description, from the event registration page:

Overview

Exclusive in-person event: get practical guidance, platform roadmap & hands-on experience to accelerate compute & AI choices for your robot

Join us for an exclusive, in-person Robotics Day/ Builders Forum built for engineers and product teams developing AMRs, humanoids, and industrial robotics applications. Co-hosted with Arrow, Qualcomm, Edge Impulse and Advantech, and supported by ecosystem partners, the event delivers practical guidance on choosing compute platforms, integrating vision and sensors, and accelerating AI development from prototype to deployment.

What to expect

• Expert keynotes on robotics platform trends, roadmap considerations, and rugged edge deployment
• Live demo showcase with real hardware and end-to-end solution workflows you can evaluate firsthand
• Three technical breakout tracks with deep dives on compute, vision and perception, and AI software optimization
• High-value networking with peer robotics builders, plus direct access to industry leaders, solution architects, and partner technical teams

You’ll leave with clearer platform direction, implementation best practices, and trusted connections for follow-up technical discussions and next-step evaluations. Attendance is limited to keep conversations focused and interactive.

To close the day, we will host a Connections Mixer at the Sky Lounge featuring a brief wrap-up and a raffle. This casual networking hour is designed to help attendees connect with peers, speakers, and solution teams in a relaxed setting. Sponsored by D3 Embedded.
————————————————————————————————–

This event is free and designed for professionals building or evaluating robotics and AMR solutions, including robotics and AMR product managers, system architects and embedded engineers, industrial automation R&D leaders, perception and vision engineers, and operations and engineering directors. We also welcome professionals tracking the latest robotics trends and platform direction.

Invitation-only access

Click Get ticket and complete the Event Registration form to apply for a free ticket. Event hosts will review submissions and email confirmed invitations (with an event code) to qualified attendees. Please present your ticket at reception to receive your full-day conference badge.

Location

Wyndham Grand Pittsburgh Downtown
600 Commonwealth Place
Pittsburgh, PA 15222

Agenda

08:30 AM – 09:00 AM – Breakfast & Connections Kickoff

09:00 AM – 09:15 AM – Opening Remarks & Day Overview 

09:15 AM – 09:45 AM – Keynote 1: Global Robotics Trends and How You Can Take Advantage (sponsored by Arrow) 

09:45 AM – 10:30 AM – Keynote 2: Utilizing Dragonwing for Industrial Arm-Based Robotics Solutions (sponsored by Qualcomm, Edge Impulse)

10:30 AM – 11:00 AM – Keynote 3: Ruggedizing Robotics Solutions for Mobility and Harsh Environments (sponsored by Advantech) 

11:00 AM – Break 

11:15 AM – 11:45 AM – Keynote 4: Selecting the Proper Cameras and Sensors for AI-Assisted Perception (sponsored by D3 Embedded) 

11:45 AM – 12:45 PM – Lunch 

12:45 PM – 03:30 PM – Three Breakout Rotations (45 min each with breaks) 

Track A: Building Out a Full-Scale Humanoid Robot from a Hardware Perspective
Track B: Leveraging Software Solutions to Get the Most Out of Your Processor
Track C: Designing and Integrating Machine Vision Solutions for AMRs and Humanoids

03:30 PM – 05:30 PM – Connections Mixer at Sky Lounge (sponsored by D3 Embedded)

To register for this free webinar, please see the event page.

The post Robotics Builders Forum offers Hardware, Know-How and Networking to Developers appeared first on Edge AI and Vision Alliance.

• NanoXplore’s NG-ULTRA FPGA becomes the first product qualified to new European ESCC 9030 standard for space applications
• The product leverages a supply chain fully based in the European Union, from design to manufacturing and test, and delivered by ST
• Its advanced digital capability enables European customers to develop higher performance, more competitive satellites and space missions

NanoXplore, the European leader in the design of SoC FPGA and radiation-hardened FPGA technologies, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announce the qualification of NG-ULTRA for space applications. This radiation-hardened SoC FPGA has been designed specifically for space applications, including low- and medium-earth orbit constellations, and is set to be used in numerous satellite equipment systems, including flagship missions such as Galileo, Copernicus, and potentially IRIS².

First product certified to ESCC 9030 for the European New Space industry

This qualification marks a major industrial and technological milestone for the European space ecosystem: NG-ULTRA is the first product qualified to ESCC 9030, a new European standard dedicated to high-performance micro-circuits in flip-chip’ed on organic substrate or plastic package. This standard delivers the reliability required for space applications while enabling a transition away from traditional ceramic-packaged solutions – well suited for deep-space but heavier and more expensive – marking a key step forward for constellations and higher-volume missions.

The “new space” dynamic (constellations, Low and Medium Earth Orbits, higher volumes) is transforming requirements for onboard digital equipment and driving a shift in scale: there is a simultaneous need for greater computing power, controlled power consumption, and contained costs compatible with large-scale deployments. NG-ULTRA addresses this challenge by enabling more data to be processed directly in orbit (edge computing), thereby limiting transmission bottlenecks between space and ground.

NG-ULTRA targets strategic functions such as on-board computers, data management and routing between sub-systems, image and video processing (real-time compression and encoding), Software Defined Radio (SDR) – enabling remote evolution of communication modes, and onboard autonomy (detection, recognition, supervision).

A secure, European supply chain

Beyond performance, this program embodies a strategic ambition to secure a sovereign and sustainable European supply chain for long-duration missions by reducing critical dependencies. For NG-ULTRA, the industrial framework combines design, manufacturing, assembly, and testing capabilities across European sites, with the aim of reconciling competitiveness, volume production, and space-grade reliability.

In addition to its own R&D and design center in Paris, Grenoble and Montpellier, NanoXplore leverages various STMicroelectronics facilities in Europe, including the Grenoble R&D and design center, the 300mm digital fab of Crolles, the space-specialist packaging facility in Rennes (France), the test and reliability site in Grenoble (France) and Agrate (Italy) and additional redundant qualified sites in Europe.

Technical specifications

With an “all-in-one” SoC (System on Chip) architecture designed specifically for platform and onboard computing applications, NG-ULTRA combines a multi-core processor with programmable hardware on a single chip. This architecture allows for greater design agility, reduces electronic board complexity and component count, and optimizes latency, mass, and power consumption.

NG-ULTRA is built on STMicroelectronics’ 28nm FD-SOI digital technology platform, recognized for its advantages in energy efficiency, resistance to space radiation and advanced architecture features. Combined with a unique advanced radiation hardening technology, the NG-ULTRA is built to survive the thermal cycles, shocks, and vibrations of launch and long-term orbital life so as to ensure best in class performances and durability in the harsh space environment throughout the mission lifetime.

The NG-ULTRA has been designed to operate reliably in harsh radiation environments, offering a Total Ionizing Dose (TID) tolerance of up to 50 krad (Si) to ensure long-term performance. It also demonstrates strong resilience to single-event effects, with Single Event Latch-up (SEL) immunity tested up to 65 MeV·cm²/mg and Single Event Upset (SEU) immunity validated for Linear Energy Transfer (LET) levels exceeding 60 MeV·cm²/mg.

NG-ULTRA integrates a full SoC based on quad core Arm® Cortex® R52 and provides high computational capability (537k LUTs + 32 Mb RAM) to address the most complex onboard computer requirements.

Its streamlined architecture drastically reduces PCB complexity and system mass—two of the most critical constraints in space design. By minimizing the component count, the NG-ULTRA simultaneously lowers total power consumption and project costs while increasing overall system reliability.

In addition, the SRAM-based architecture of the NG-ULTRA enables an adaptive hardware approach, allowing for unlimited on-orbit reconfiguration. This “hardware-as-software” flexibility allows operators to update functionality post-launch, adapt to evolving communication standards, or optimize the chip for different mission phases. The NG-ULTRA thus provides a future-proof platform that extends the operational relevance of assets long after they leave the launchpad.

To facilitate adoption, NG-ULTRA is also available as an evaluation kit — a complete prototyping platform that allows to rapidly validate performance and interfaces, reduce integration risks, and accelerate software and onboard logic development prior to flight-board production.

About NanoXplore

NanoXplore is a French fabless company designing radiation-hardened FPGA components for high-reliability environments, specifically space and avionics. The company recently launched the NG-ULTRA, the world’s most advanced radiation-hardened FPGA SoC. With an international presence, NanoXplore is the European leader in the design and development of SoC FPGA technologies and a key partner to the major players in the aerospace sector.

About STMicroelectronics

At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.

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Why Ultralytics YOLO26 matters for your projects:

The architecture is designed end-to-end, which means no more NMS (non-maximum suppression) post-processing. That translates to simpler deployment and genuinely faster inference. It talks about up to 43% speed improvements on CPUs compared to previous versions. For anyone running projects on Orange Pi, Raspberry Pi, or similar setups, that’s a nice boost.

Small object detection also gets a nice bump thanks to ProgLoss and STAL improvements. If you’re working on anything that needs to catch smaller details (maybe retail analytics, inspection systems, drone footage analysis), this should be super interesting.

Ultralytics YOLO26 comes in n/s/m/l flavours across all the usual tasks: detection, segmentation, pose estimation, oriented bounding boxes, and classification. Good options for the speed vs. accuracy tradeoff based on your hardware and use case.

Bug fixes and stability improvements:

Beyond Ultralytics YOLO26, this release cleans up several issues from v1.5.2. Resource leaks in GStreamer and AxInferenceNet pipelines are fixed, segmentation faults when recreating pipelines with trackers are sorted, and there’s better performance for cascaded pipelines with secondary models.

If you’ve got systems with multiple Metis devices, there’s also a deadlock fix for setups with more than eight of them.

Get it now:

Head over to the usual spots to grab v1.5.3. If you’re already running projects on earlier versions, the stability fixes alone make this a welcome update.

The post Voyager SDK v1.5.3 is Live, and That Means Ultralytics YOLO26 Support appeared first on Edge AI and Vision Alliance.